The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 05, 2016

Filed:

Dec. 27, 2013
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventor:

Tom Lii, Plano, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/336 (2006.01); H01L 21/28 (2006.01); H01L 21/321 (2006.01); H01L 21/3213 (2006.01); H01L 21/8234 (2006.01); H01L 29/423 (2006.01); H01L 29/49 (2006.01); H01L 29/51 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01); H01L 21/3105 (2006.01); H01L 21/311 (2006.01);
U.S. Cl.
CPC ...
H01L 21/823437 (2013.01); H01L 21/28114 (2013.01); H01L 29/42376 (2013.01); H01L 29/4966 (2013.01); H01L 29/518 (2013.01); H01L 29/66545 (2013.01); H01L 29/78 (2013.01); H01L 21/31053 (2013.01); H01L 21/31116 (2013.01);
Abstract

An integrated circuit containing metal replacement gates may be formed by forming a CMP stop layer over sacrificial gates, and forming a dielectric fill layer over the CMP stop layer. Dielectric material from the dielectric fill layer is removed from over the sacrificial gates using a CMP process which exposes the CMP stop layer over the sacrificial gates but does not expose the sacrificial gates. The CMP stop layer is removed from over the sacrificial gates using a plasma etch process. In one version, the plasma etch process may be selective to the CMP stop layer. In another version, the plasma etch process may be a non-selective etch process. After the sacrificial gates are exposed by the plasma etch process, the sacrificial gates are removed and the metal replacement gates are formed.


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