The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 05, 2016

Filed:

Apr. 28, 2015
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Frank Pueschner, Kelheim, DE;

Thomas Spoettl, Mintraching, DE;

Jens Pohl, Bernhardswald, DE;

Gottfried Beer, Nittendorf, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 19/06 (2006.01); G06K 19/077 (2006.01); G06K 19/07 (2006.01); H01L 25/00 (2006.01); H01L 23/488 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
G06K 19/07705 (2013.01); G06K 19/077 (2013.01); G06K 19/0716 (2013.01); G06K 19/07754 (2013.01); H01L 21/48 (2013.01); H01L 23/488 (2013.01); H01L 25/50 (2013.01); H01L 2224/16225 (2013.01);
Abstract

In various embodiments, a smart card module is provided. The smart card module includes a carrier having a first main surface and a second main surface opposite the first main surface. The carrier has at least one plated-through hole. The smart card module further includes a contact array arranged above the first main surface of the carrier and having a plurality of electrical contacts. At least one electrical contact of the plurality of electrical contacts is electrically connected to the plated-through hole. The smart card module further includes a chip arranged above the second main surface. The chip is electrically coupled to at least one electrical contact of the plurality of electrical contacts by the plated-through hole. The smart card module further includes at least one optoelectronic component arranged above the second main surface and electrically conductively connected to the chip.


Find Patent Forward Citations

Pueschner, Frank. (2016). Smart card module, smart card body, smart card and smart card production method (U.S. Patent No. 9384437). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9384437

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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