The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 28, 2016

Filed:

May. 19, 2011
Applicant:

Tsung-yuan Chen, Taoyuan County, TW;

Inventor:

Tsung-Yuan Chen, Taoyuan County, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/36 (2006.01); H05K 3/00 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H05K 3/0058 (2013.01); H01L 21/481 (2013.01); H01L 24/97 (2013.01); H05K 3/0097 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 24/81 (2013.01); H01L 24/85 (2013.01); H01L 2223/54426 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/81132 (2013.01); H01L 2224/85132 (2013.01); H01L 2224/97 (2013.01); Y10T 29/49128 (2015.01);
Abstract

A substrate strip with wiring is provided. The substrate strip includes a plurality of wiring blocks, a carrying substrate, and an adhesive layer. Each of the wiring blocks includes at least one wiring board unit, and each of the wiring board unit includes an insulating layer and a wiring layer disposed on the insulating layer. The carrying substrate has a carrying surface. The adhesive layer is disposed between the carrying surface and the wiring layers, and adheres to the wiring blocks and the carrying substrate. When the adhesive layer is separated from the wiring blocks, the wiring layers are kept on the insulating layers. Further, a manufacturing method for the substrate is provided.


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