The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 28, 2016
Filed:
Jan. 23, 2015
Applicant:
Epistar Corporation, Hsinchu, TW;
Inventors:
Hsing-Kuo Hsia, Jhubei, TW;
Chih-Kuang Yu, Chiayi, TW;
Hung-Yi Kuo, Taipei, TW;
Chyi Shyuan Chern, Taipei, TW;
Assignee:
EPISTAR CORPORATION, Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/311 (2006.01); H01L 33/64 (2010.01); H01L 25/075 (2006.01); H01L 33/54 (2010.01); H01L 33/58 (2010.01);
U.S. Cl.
CPC ...
H01L 33/64 (2013.01); H01L 25/075 (2013.01); H01L 33/54 (2013.01); H01L 33/58 (2013.01); H01L 33/641 (2013.01); H01L 33/642 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01);
Abstract
An apparatus includes a wafer with a number of openings therein. For each opening, an LED device is coupled to a conductive carrier and the wafer in a manner so that each of the coupled LED device and a portion of the conductive carrier at least partially fill the opening. A method of fabricating an LED device includes forming a number of openings in a wafer. The method also includes coupling light-emitting diode (LED) devices to conductive carriers. The LED devices with conductive carriers at least partially fill each of the openings.