The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 28, 2016

Filed:

Aug. 26, 2015
Applicant:

Renesas Electronics Corporation, Kawasaki-shi, JP;

Inventors:

Youichi Yamamoto, Kawasaki, JP;

Naomi Fukumaki, Kawasaki, JP;

Misato Sakamoto, Kawasaki, JP;

Yoshitake Kato, Kawasaki, JP;

Assignee:

Renesas Electronics Corporation, Kawasaki-shi, Kanagawa, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/283 (2006.01); H01L 21/441 (2006.01); H01L 21/8232 (2006.01); H01L 49/02 (2006.01); H01L 21/28 (2006.01); H01L 29/51 (2006.01); H01L 21/31 (2006.01); H01L 27/108 (2006.01); H01L 21/285 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 28/60 (2013.01); H01L 21/28088 (2013.01); H01L 21/28568 (2013.01); H01L 21/31 (2013.01); H01L 27/1085 (2013.01); H01L 29/517 (2013.01); H01L 21/28562 (2013.01); H01L 21/76856 (2013.01); H01L 28/91 (2013.01);
Abstract

A method for manufacturing a semiconductor device includes a capacitor element in which a capacitance dielectric film is provided between an upper electrode film and a lower electrode film, includes forming the lower electrode film over the semiconductor substrate, forming the capacitance dielectric film over the lower electrode film, and forming the upper electrode film over the capacitance dielectric film, wherein, an entire surface layer of the lower electrode film is formed of a polycrystalline titanium nitride. At the portion of the capacitance dielectric film where directly contacting the entire surface layer of the lower electrode is formed of a polycrystalline metal oxide, and the polycrystalline metal oxide is formed by an ALD method and inherits a crystallinity of the polycrystalline titanium nitride.


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