The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 28, 2016
Filed:
Dec. 30, 2014
Stmicroelectronics Pte Ltd, Singapore, SG;
STMICROELECTRONICS PTE LTD, Singapore, SG;
Abstract
A method of making an electronic device may include positioning an integrated circuit (IC) die on an upper surface of a grid array substrate having connections on a lower surface thereof and coupling respective bond pads of the IC die to the grid array with bond wires. The method may also include forming a first encapsulating layer over the IC die and bond wires and positioning a heat spreader on the substrate above the first encapsulating layer after forming the first encapsulating layer. The method may further include forming a second encapsulating layer over the first encapsulating layer and embedding the heat spreader in the second encapsulating layer.