The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 28, 2016
Filed:
Mar. 28, 2014
David Won-jun Song, Chandler, AZ (US);
Christopher Roy Schroeder, Gilbert, AZ (US);
Joseph Walczyk, Tigard, OR (US);
Lothar Kress, Portland, OR (US);
Todd Michael Young, Gilbert, AZ (US);
Robert Levi Bennett, Hillsboro, OR (US);
Arun Krishnamoorthy, Portland, OR (US);
Paul Jonathan Diglio, Beaverton, OR (US);
Charles Clifton Fulton, Phoenix, AZ (US);
Sruti Chigullapalli, Chandler, AZ (US);
David Won-jun Song, Chandler, AZ (US);
Christopher Roy Schroeder, Gilbert, AZ (US);
Joseph Walczyk, Tigard, OR (US);
Lothar Kress, Portland, OR (US);
Todd Michael Young, Gilbert, AZ (US);
Robert Levi Bennett, Hillsboro, OR (US);
Arun Krishnamoorthy, Portland, OR (US);
Paul Jonathan Diglio, Beaverton, OR (US);
Charles Clifton Fulton, Phoenix, AZ (US);
Sruti Chigullapalli, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Thermal interface material handing is described for thermal control of an electronic component under test. In one example, a thermal control unit is adapted to control the temperature of at least a portion of an electronic component during testing. A pedestal between the thermal control unit and the electronic component conducts heat from the electronic component to the thermal head. A conduit extends through a portion of the pedestal, to permit the flow of a liquid thermal interface material from an external source to a space between the pedestal and the electronic component. The liquid thermal interface material improves heat conduction between the electronic component and the pedestal. An elastomeric seal between the electronic device and the pedestal constrains the thermal interface fluid within the space between the electronic component and the pedestal.