The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 21, 2016
Filed:
May. 24, 2013
Applicant:
Micron Technology, Inc., Boise, ID (US);
Inventors:
Myung Jin Yim, Chandler, AZ (US);
Nanette Quevedo, Chandler, AZ (US);
Richard Strode, Gilbert, AZ (US);
Assignee:
Micron Technology, Inc., Boise, ID (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); H05K 1/18 (2006.01); H01L 21/56 (2006.01); H01L 23/498 (2006.01); H01L 25/10 (2006.01); G06F 1/16 (2006.01); H05K 3/34 (2006.01); H01L 25/00 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); G06F 1/16 (2013.01); H01L 21/563 (2013.01); H01L 23/315 (2013.01); H01L 23/49816 (2013.01); H01L 25/105 (2013.01); H01L 25/50 (2013.01); H05K 3/341 (2013.01); H01L 23/3114 (2013.01); H01L 23/3128 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73203 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/01068 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15331 (2013.01); Y10T 29/49117 (2015.01); Y10T 29/49128 (2015.01); Y10T 29/49179 (2015.01);
Abstract
Embodiments include but are not limited to apparatuses and systems including semiconductor packages, e.g. memory packages, having a substrate or a first package, and a second package coupled to the substrate or the first package, wherein the second package includes at least one die and an underfill material disposed in a portion, but not an entirety, of an area between the package and the substrate or the first package. Other embodiments may be described and claimed.