The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 21, 2016

Filed:

Nov. 08, 2013
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

Wolfgang Mueller, Garden City, ID (US);

Sanh D. Tang, Boise, ID (US);

Sourabh Dhir, Boise, ID (US);

Srinivas Pulugurtha, Boise, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/78 (2006.01); G11C 11/40 (2006.01); H01L 27/02 (2006.01); H01L 27/105 (2006.01); H01L 29/66 (2006.01); H01L 27/108 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7827 (2013.01); G11C 11/40 (2013.01); H01L 27/0207 (2013.01); H01L 27/1052 (2013.01); H01L 27/10873 (2013.01); H01L 27/10885 (2013.01); H01L 29/66666 (2013.01); H01L 27/10855 (2013.01); H01L 27/10891 (2013.01);
Abstract

A semiconductor device may include a memory array including vertical memory cells connected to a digit line, word lines, and a body connection line. A row or column of the memory array may include one or more pillars connected to the body connection line. A voltage may be applied to the body connection line through at least one pillar connected to the body connection line. Application of the voltage to the body connection line may reduce floating body effects. Methods of forming a connection between at least one pillar and a voltage supply are disclosed. Semiconductor devices including such connections are also disclosed.


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