The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 21, 2016

Filed:

Nov. 19, 2012
Applicants:

Koito Manufacturing Co., Ltd., Tokyo, JP;

Tokyo University of Science, Tokyo, JP;

Inventors:

Akihiro Nomura, Shizuoka, JP;

Kazuhiro Ohkawa, Tokyo, JP;

Akira Hirako, Tokyo, JP;

Assignees:

KOITO MANUFACTURING CO., LTD., Minato-Ku, Tokyo, JP;

TOKYO UNIVERSITY OF SCIENCE, Shinjuku-Ku, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 29/20 (2006.01); H01L 21/02 (2006.01); H01L 21/20 (2006.01);
U.S. Cl.
CPC ...
H01L 29/2003 (2013.01); H01L 21/0242 (2013.01); H01L 21/0254 (2013.01); H01L 21/0262 (2013.01); H01L 21/02433 (2013.01); H01L 21/02458 (2013.01); H01L 21/02614 (2013.01); H01L 21/20 (2013.01); H01L 33/007 (2013.01); H01L 33/0066 (2013.01);
Abstract

In a semiconductor device, a YAG substrate is formed as a single-crystal substrate of any of surface orientations (100), (110), and (111). In the fabrication of the semiconductor device, a TMAl gas is first fed onto the YAG substrate so as to form a nucleation layer made of aluminum, which is a group-III element. Then, an NHgas is fed onto the nucleation layer. This turns the surface of the nucleation layer into a group-V element and then forms a group-III-V compound layer of AlN. Then, a mixed gas of TMAl gas and NHgas is fed onto the group-III-V compound layer so as to form another group-III-V compound layer. Finally, a group-III nitride semiconductor layer is crystal-grown on the group-III compound layer.


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