The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 21, 2016

Filed:

May. 23, 2014
Applicant:

Ebara Corporation, Tokyo, JP;

Inventors:

Toru Maruyama, Tokyo, JP;

Mitsunori Komatsu, Tokyo, JP;

Assignee:

EBARA CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67017 (2013.01); H01L 21/67051 (2013.01); H01L 21/67253 (2013.01);
Abstract

A substrate processing apparatusincludes a substrate processing unitconfigured to process a substrate W by supplying a mixed liquid M of a first liquid C and a second liquid D to the substrate W, a first flow rate regulatordisposed in a first supply pipeconfigured to allow the first liquid C to flow therethrough, and the first flow rate regulatorconfigured to measure a flow rate by a differential pressure and to regulate the flow rate, a second flow rate regulatordisposed in a second supply pipeconfigured to allow the second liquid D to flow therethrough, and the second flow rate regulatorconfigured to measure a flow rate by a differential pressure and to regulate the flow rate, a concentration meterdisposed in a mixed liquid pipeconfigured to guide the mixed liquid M with a mixture of the first liquid C having passed through the first flow rate regulatorand the second liquid D having passed through the second flow rate regulatorto the substrate processing unit, and a controllerconfigured to take difference elimination measures when the difference between a conforming concentration as the concentration of the mixed liquid M suitable for processing the substrate W in the substrate processing unitand the concentration measured with the concentration meterexceeds a predetermined value. With this, even if zero-point deviation of a differential pressure flowmeter occurs, it is possible to eliminate the difference in concentration.


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