The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 21, 2016
Filed:
Jun. 20, 2013
Applicant:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Inventors:
Hsiao-Tsung Yen, Tainan, TW;
Shyh-An Chi, Hsinchu, TW;
Assignee:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/28 (2006.01); H01F 5/00 (2006.01); H01F 7/06 (2006.01); H01F 17/00 (2006.01); H01F 21/12 (2006.01);
U.S. Cl.
CPC ...
H01F 17/0013 (2013.01); H01F 2017/004 (2013.01); H01F 2021/125 (2013.01); Y10T 29/4902 (2015.01);
Abstract
An inductor assembly generally comprises at least one helical inductive component comprising that includes a plurality of conductive line layers having conductive lines therein. A plurality of vias are configured to couple conductive lines from two or more conductive line layers such that a spacing between two adjacent parallel conductive lines, in different conductive line layers from each other, is two or more times a distance between respective bottom surfaces of two adjacent conductive line layers.