The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 21, 2016
Filed:
Apr. 30, 2013
Applicant:
Shin-etsu Chemical Co., Ltd., Tokyo, JP;
Inventors:
Takeru Watanabe, Jyoetsu, JP;
Seiichiro Tachibana, Jyoetsu, JP;
Toshihiko Fujii, Jyoetsu, JP;
Kazumi Noda, Jyoetsu, JP;
Toshiharu Yano, Jyoetsu, JP;
Takeshi Kinsho, Jyoetsu, JP;
Assignee:
SHIN-ETSU CHEMICAL CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/11 (2006.01); H01L 21/027 (2006.01); G03F 7/09 (2006.01); H01L 21/308 (2006.01); H01L 21/311 (2006.01);
U.S. Cl.
CPC ...
G03F 7/094 (2013.01); H01L 21/3081 (2013.01); H01L 21/0271 (2013.01); H01L 21/31116 (2013.01); H01L 21/31138 (2013.01);
Abstract
The invention provides an organic film composition comprises (A) a heat-decomposable polymer, (B) an organic solvent, and (C) an aromatic ring containing resin, with the weight reduction rate of (A) the heat-decomposable polymer from 30° C. to 250° C. being 40% or more by mass. There can be provided an organic film composition having not only a high dry etching resistance but also an excellent filling-up or flattening characteristics.