The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 21, 2016

Filed:

Jul. 22, 2014
Applicant:

Globalfoundries Inc., Grand Cayman, KY;

Inventors:

Suresh Uppal, Clifton Park, NY (US);

Randy W. Mann, Milton, NY (US);

William McMahon, Scarsdale, NY (US);

Assignee:

GLOBALFOUNDRIES INC., Grand Cayman, KY;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G06F 17/00 (2006.01); G01R 31/28 (2006.01); H01L 23/525 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
G01R 31/2884 (2013.01); H01L 22/14 (2013.01); H01L 22/34 (2013.01); H01L 23/5256 (2013.01);
Abstract

Wafer test structures and methods of providing wafer test structures are described. The methods include: fabricating multiple test devices and multiple fuse devices on the wafer, each test device having a respective fuse device associated therewith, which open circuits upon failure of the test device; and fabricating a selection circuit operative to selectively connect one test device to a sense contact pad, and the other test devices to a stress contact pad. The selection circuit facilitates sensing one or more electrical signals of the one test device by electrical contact with the sense contact pad, while stress testing the other test devices by electrical contact with the stress contact pad. In one embodiment, each test device has respective first and second switch devices, operative to selectively electrically connect the test device to the sense or stress contact pads. In another embodiment, the method includes wafer testing using the test structure.


Find Patent Forward Citations

Loading…