The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 14, 2016
Filed:
Jul. 17, 2014
Qualcomm Incorporated, San Diego, CA (US);
Jong-Hoon Lee, San Diego, CA (US);
Young Kyu Song, San Diego, CA (US);
Daeik Daniel Kim, San Diego, CA (US);
Jung Ho Yoon, San Diego, CA (US);
Uei-Ming Jow, San Diego, CA (US);
Mario Francisco Velez, San Diego, CA (US);
Jonghae Kim, San Diego, CA (US);
Xiaonan Zhang, San Diego, CA (US);
Ryan David Lane, San Diego, CA (US);
QUALCOMM Incorporated, San Diego, CA (US);
Abstract
Some features pertain to an integrated device (e.g., package-on-package (PoP) device) that includes a substrate, a first die, a first encapsulation layer, a first redistribution portion, a second die, a second encapsulation layer, and a second redistribution portion. The substrate includes a first surface and a second surface. The substrate includes a capacitor. The first die is coupled to the first surface of the substrate. The first encapsulation layer encapsulates the first die. The first redistribution portion is coupled to the first encapsulation. The second die is coupled to the second surface of the substrate. The second encapsulation layer encapsulates the second die. The second redistribution portion is coupled to the second encapsulation layer.