The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 14, 2016
Filed:
May. 12, 2015
Shinkawa Ltd., Tokyo, JP;
SHINKAWA LTD., Tokyo, JP;
Abstract
Provided is a wire-bonding apparatus () including: a capillary () through which a wire () is inserted; a nonsticking determination circuit () configured to apply a predetermined electrical signal between a bonding target and the wire () in a clamped state and to determine whether or not the wire () and the bonding target is sticking as well as whether or not the wire () is disconnected based on a response of the application of the predetermined electrical signal; an annular projecting length detection ring () disposed coaxially with the capillary (); and a projecting length determination circuit () configured to determine whether or not a projecting length of a wire tail projecting from the tip of the capillary () is appropriate based on detection on whether or not power is conductive when a predetermined inspection voltage is applied between the wire () and the projecting length detection ring () as well as a presence of a discharge spark when a predetermined inspection high voltage is applied between the wire () and the projecting length detection ring ().