The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 07, 2016

Filed:

Jul. 13, 2012
Applicants:

Goro Yasutomi, Fukuoka, JP;

Yukimasa Hayashida, Fukuoka, JP;

Inventors:

Goro Yasutomi, Fukuoka, JP;

Yukimasa Hayashida, Fukuoka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); H05K 7/02 (2006.01); H01L 23/10 (2006.01); H05K 7/14 (2006.01);
U.S. Cl.
CPC ...
H05K 7/02 (2013.01); H01L 23/10 (2013.01); H05K 7/14 (2013.01); H01L 2924/0002 (2013.01);
Abstract

It is an object of the present invention to provide an easily assemblable semiconductor device including a cover that covers a top of a case and is reliably fixed to the case defining an outline of the semiconductor device. A semiconductor device according to the present invention includes: a case defining an outline of the semiconductor device; a cover covering a top of the case; and a fastener mechanically fixing the cover to the case, a through-hole is formed in the cover, the case includes a projection inserted into the through-hole, and the fastener is attachable to the projection inserted into the through-hole of the cover from the outside of the cover and locks the projection upon the attachment to prevent the projection from falling off the through-hole.


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