The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 07, 2016

Filed:

Jul. 08, 2014
Applicant:

Qualcomm Mems Technologies, Inc., San Diego, CA (US);

Inventors:

Chi Shun Lo, San Diego, CA (US);

Jonghae Kim, San Diego, CA (US);

Chengjie Zuo, Santee, CA (US);

Changhan Hobie Yun, San Diego, CA (US);

Assignee:

QUALCOMM MEMS Technologies, Inc., San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/16 (2006.01); H01F 27/28 (2006.01); H01L 21/02 (2006.01); H05K 3/46 (2006.01); H01F 17/00 (2006.01);
U.S. Cl.
CPC ...
H05K 3/465 (2013.01); H01F 27/2804 (2013.01); H01F 2017/002 (2013.01); H01F 2017/004 (2013.01);
Abstract

This disclosure provides implementations of inductors, transformers, and related processes. In one aspect, a device includes a substrate having first and second surfaces. A first inducting arrangement includes a first set of vias, a second set of vias, a first set of traces arranged over the first surface connecting the first and second vias, and a second set of traces arranged over the second surface connecting the first and second vias. A second inducting arrangement is inductively-coupled and interleaved with the first inducting arrangement and includes a third set of vias, a fourth set of vias, a third set of traces arranged over the first surface connecting the third and fourth vias, and a fourth set of traces arranged over the second surface connecting the third and fourth vias. One or more sets of dielectric layers insulate portions of the traces from one another.


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