The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 07, 2016

Filed:

Feb. 17, 2015
Applicants:

Risto Tuominen, Helsinki, FI;

Petteri Palm, Regensburg, DE;

Antti Iihola, Helsinki, FI;

Inventors:

Risto Tuominen, Helsinki, FI;

Petteri Palm, Regensburg, DE;

Antti Iihola, Helsinki, FI;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H05K 1/18 (2006.01); H01L 23/31 (2006.01); H01L 23/538 (2006.01); H01L 23/544 (2006.01); H01L 25/065 (2006.01); H05K 1/02 (2006.01); H05K 3/38 (2006.01); H05K 1/03 (2006.01); H05K 1/11 (2006.01); H01L 23/00 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/188 (2013.01); H01L 23/3135 (2013.01); H01L 23/5389 (2013.01); H01L 23/544 (2013.01); H01L 24/18 (2013.01); H01L 25/0652 (2013.01); H05K 1/0271 (2013.01); H05K 1/0366 (2013.01); H05K 1/115 (2013.01); H05K 1/185 (2013.01); H05K 3/38 (2013.01); H01L 24/05 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 2223/54426 (2013.01); H01L 2223/54473 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/20 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83855 (2013.01); H01L 2224/92144 (2013.01); H01L 2924/01002 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01027 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/01087 (2013.01); H01L 2924/01327 (2013.01); H01L 2924/07802 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/15747 (2013.01); H01L 2924/18161 (2013.01); H01L 2924/3025 (2013.01); H05K 3/4611 (2013.01); H05K 2201/0355 (2013.01); H05K 2201/068 (2013.01); H05K 2203/063 (2013.01); H05K 2203/1469 (2013.01); Y10T 29/4913 (2015.01);
Abstract

This publication discloses an electronic module and a method for manufacturing an electronic module, in which a component is glued to the surface of a conductive layer, from which conductive layer conductive patterns are later formed. After gluing the component, an insulating-material layer, which surrounds the component attached to the conductive layer, is formed on, or attached to the surface of the conductive layer. After the gluing of the component, feed-throughs are also made, through which electrical contacts can be made between the conductive layer and the contact zones of the component. After this, conductive patterns are made from the conductive layer, to the surface of which the component is glued.


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