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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9363891 B1

PDFFull Text
Date of Patent:
Jun. 07, 2016

Filed:

Apr. 07, 2015

Printed wiring board and method for manufacturing the same

Applicant:

Ibiden Co., Ltd., Ogaki-shi, JP;

Inventors:

Satoru Kawai, Ogaki, JP;

Kenji Sakai, Ibi-gun, JP;

Liyi Chen, Ogaki, JP;

Assignee:

IBIDEN CO., LTD., Ogaki-shi, JP;

Attorney:

Oblon, McClelland, Maier & Neustadt, L.L.P

Primary Examiner:

Sherman Ng

Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/09 (2006.01); H05K 7/12 (2006.01); H05K 3/40 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 3/34 (2006.01); H05K 3/20 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/112 (2013.01); H05K 1/0298 (2013.01); H05K 1/032 (2013.01); H05K 1/113 (2013.01); H05K 3/3457 (2013.01); H05K 3/4007 (2013.01); H05K 3/4682 (2013.01); H05K 3/205 (2013.01); H05K 3/4644 (2013.01); H05K 2201/0195 (2013.01); H05K 2201/0367 (2013.01); H05K 2201/096 (2013.01); H05K 2201/09472 (2013.01); H05K 2203/0361 (2013.01); Y10T 29/4913 (2015.01); Y10T 29/49126 (2015.01); Y10T 29/49144 (2015.01); Y10T 29/49155 (2015.01); Y10T 29/49165 (2015.01);
Abstract

A printed wiring board includes a resin insulation layer having a first surface and a second surface on an opposite side of the first surface, the resin insulation layer having an opening for a via conductor, a pad formed on the first surface of the resin insulation layer and provided to mount an electronic component, a conductive circuit formed on the second surface of the resin insulation layer, and a via conductor formed in the opening and connecting the pad and the conductive circuit. The pad has an embedded portion embedded in the resin insulation layer and a protruding portion protruding from the resin insulation layer, and the embedded portion has an external shape which is greater than an external shape the protruding portion.

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