The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 07, 2016
Filed:
Aug. 11, 2015
Applicant:
Kandou Labs S.a., Lausanne, CH;
Inventors:
John Fox, Kislingbury, GB;
Brian Holden, Monte Sereno, CA (US);
Peter Hunt, Northampton, GB;
John D. Keay, Bedford, GB;
Amin Shokrollahi, Preverenges, CH;
Andrew Kevin John Stewart, Astcote, GB;
Giuseppe Surace, Northampton, GB;
Roger Ulrich, Bern, CH;
Richard Simpson, Bedford, GB;
Assignee:
Kandou Labs, S.A., , CH;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04B 1/40 (2015.01); H04L 29/08 (2006.01); H03K 19/0175 (2006.01); H03K 19/0185 (2006.01); H01L 23/14 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H04B 1/40 (2013.01); H03K 19/017509 (2013.01); H03K 19/018521 (2013.01); H04L 67/12 (2013.01); H01L 23/147 (2013.01); H01L 23/5384 (2013.01); H01L 2224/16 (2013.01); H01L 2924/15174 (2013.01); H01L 2924/15192 (2013.01);
Abstract
Systems and methods are described for transmitting data over physical channels to provide a high bandwidth, low latency interface between integrated circuit chips with low power utilization. Communication is performed using group signaling over multiple wires using a vector signaling code, where each wire carries a low-swing signal that may take on more than two signal values.