The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 07, 2016

Filed:

Oct. 16, 2015
Applicant:

Intermolecular Inc., San Jose, CA (US);

Inventors:

Tony P. Chiang, Campbell, CA (US);

Majid Keshavarz, Pleasanton, CA (US);

David E Lazovsky, Los Gatos, CA (US);

Assignee:

Intermolecular, Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 23/532 (2006.01); B82Y 30/00 (2011.01); H01L 21/31 (2006.01); H01L 29/06 (2006.01); H01L 49/02 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5329 (2013.01); B82Y 30/00 (2013.01); H01L 21/31 (2013.01); H01L 21/76805 (2013.01); H01L 21/76814 (2013.01); H01L 21/76831 (2013.01); H01L 21/76843 (2013.01); H01L 21/76846 (2013.01); H01L 21/76849 (2013.01); H01L 21/76873 (2013.01); H01L 21/76879 (2013.01); H01L 29/06 (2013.01); H01L 28/65 (2013.01); H01L 2924/0002 (2013.01); Y10T 428/249953 (2015.04);
Abstract

Methods for sealing a porous dielectric are presented including: receiving a substrate, the substrate including the porous dielectric; exposing the substrate to an organosilane, where the organosilane includes a hydrolysable group for facilitating attachment with the porous dielectric, and where the organosilane does not include an alkyl group; and forming a layer as a result of the exposing to seal the porous dielectric. In some embodiments, methods are presented where the organosilane includes: alkynyl groups, aryl groups, fluoroalkyl groups, heteroaryl groups, alcohol groups, thiol groups, amine groups, thiocarbamate groups, ester groups, ether groups, sulfide groups, and nitrile groups. In some embodiments, method further include: removing contamination from the porous dielectric and a conductive region of the substrate prior to the exposing; and removing contamination from the conductive region after the forming.


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