The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9362165 B1

PDF
Full Text
Expired
Date of Patent:
Jun. 07, 2016

Filed:

May. 08, 2015
Applicant:

Globalfoundries Inc., Grand Cayman, KY;

Inventors:

Guillaume Bouche, Albany, NY (US);

Andy Wei, Queensbury, NY (US);

Sudharshanan Raghunathan, Mechanicsville, NY (US);

Assignee:

GLOBALFOUNDRIES INC., Grand Cayman, KY;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 21/02 (2006.01); H01L 21/768 (2006.01); H01L 23/522 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76843 (2013.01); H01L 21/7684 (2013.01); H01L 21/76802 (2013.01); H01L 23/5226 (2013.01); H01L 23/5329 (2013.01);
Abstract

A method of forming 2D self-aligned vias before forming a subsequent metal layer and reducing capacitance of the resulting device and the resulting device are provided. Embodiments include forming dummy metal lines in a SiOC layer and extending in a first direction; replacing the dummy metal lines with metal lines, each metal line having a nitride cap; forming a softmask stack over the nitride cap and the SiOC layer; patterning a plurality of vias through the softmask stack down to the metal lines, the plurality of vias self-aligned along a second direction; removing the softmask stack; forming second dummy metal lines over the metal lines and extending in the second direction; forming a second SiOC layer between the dummy second metal lines on the SiOC layer; and replacing the dummy second metal lines with second metal lines, the second metal lines electrically connected to the metal lines through a via.


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