The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 07, 2016
Filed:
Nov. 10, 2014
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Inventor:
Yu-Chung Su, Hsinchu, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/004 (2006.01); H01L 21/027 (2006.01); G03F 7/40 (2006.01); G03F 7/16 (2006.01); G03F 7/09 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0274 (2013.01); G03F 7/091 (2013.01); G03F 7/162 (2013.01); G03F 7/168 (2013.01); G03F 7/40 (2013.01); H01L 21/0276 (2013.01);
Abstract
The present disclosure provides a method that includes forming a polymeric material layer on a substrate, wherein the polymeric material layer includes de-crosslinkable crosslink material (DCM); performing a first baking process having a first baking temperature to the polymeric material layer, thereby initiating crosslinking function of the DCM; and performing a second baking process having a second baking temperature to the polymeric material layer, thereby initiating de-crosslinking function of the DCM.