The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 07, 2016

Filed:

Nov. 10, 2014
Applicant:

Toyo Tire & Rubber Co., Ltd., Osaka-shi, JP;

Inventors:

Yoshiyuki Nakai, Osaka, JP;

Tsuyoshi Kimura, Osaka, JP;

Atsushi Kazuno, Osaka, JP;

Kazuyuki Ogawa, Osaka, JP;

Tetsuo Shimomura, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 37/24 (2012.01); B24D 3/26 (2006.01); C08G 18/10 (2006.01); C08G 18/48 (2006.01); C08G 18/66 (2006.01); C08G 18/72 (2006.01); B24D 3/32 (2006.01); C08G 18/08 (2006.01); B24B 29/00 (2006.01); C08G 18/38 (2006.01); C08G 18/79 (2006.01);
U.S. Cl.
CPC ...
B24B 37/24 (2013.01); B24D 3/26 (2013.01); B24D 3/32 (2013.01); C08G 18/10 (2013.01); C08G 18/4854 (2013.01); C08G 18/6674 (2013.01); C08G 18/724 (2013.01); B24B 29/00 (2013.01); C08G 18/14 (2013.01);
Abstract

A polishing pad capable of maintaining a high level of dimensional stability during absorption of moisture or water includes a polishing layer including a polyurethane foam having fine cells, wherein the polyurethane foam includes a cured product of a reaction of an isocyanate-terminated prepolymer (a), a polymerized diisocyanate, and a chain extender, and the isocyanate-terminated prepolymer (a) includes an isocyanate monomer, a high molecular weight polyol (a), and a low molecular weight polyol. A method for manufacturing such a polishing pad includes mixing a first component containing an isocyanate-terminated prepolymer with a second component containing a chain extender and curing the mixture to form a polyurethane foam. The pad so made is used in the manufacture of semiconductor devices.


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