The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 31, 2016

Filed:

Jun. 16, 2015
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Fei Liu, Yorktown Heights, NY (US);

Christine Q. Ouyang, Yorktown Heights, NY (US);

Alexander Reznicek, Troy, NY (US);

Jeremy D. Schaub, Austin, TX (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/12 (2006.01); H01L 31/0232 (2014.01); H01L 27/144 (2006.01); H01L 31/18 (2006.01); H01L 27/146 (2006.01); H01L 31/105 (2006.01);
U.S. Cl.
CPC ...
H01L 31/02327 (2013.01); H01L 27/1443 (2013.01); H01L 27/1463 (2013.01); H01L 27/14609 (2013.01); H01L 27/14612 (2013.01); H01L 27/14625 (2013.01); H01L 27/14634 (2013.01); H01L 27/14643 (2013.01); H01L 31/105 (2013.01); H01L 31/184 (2013.01); H01L 31/1804 (2013.01); H01L 31/1808 (2013.01);
Abstract

A method for monolithically integrating semiconductor waveguides, photodetectors and logic devices, i.e., field effect transistors, on a same substrate is provided. The method includes the use of a double semiconductor-on-insulator substrate that includes from bottom to top, a handle substrate, a first insulator layer, a first semiconductor material layer, a second insulator layer, and a second semiconductor material layer. The waveguides, photodetectors and logic devices can be formed in different regions of the substrate and are present atop a first insulator layer of the double semiconductor-on-insulator substrate.


Find Patent Forward Citations

Loading…