The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 31, 2016

Filed:

Mar. 07, 2013
Applicant:

Taiwan Semiconductor Manufacturing Co. Ltd., Hsin-Chu, TW;

Inventors:

Wei-Yuan Lu, Taipei, TW;

Lilly Su, Chubei, TW;

Chun-Hung Huang, Zhubei, TW;

Chii-Horng Li, Zhubei, TW;

Jyh-Huei Chen, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/78 (2006.01); H01L 29/66 (2006.01); H01L 29/16 (2006.01); H01L 21/8234 (2006.01); H01L 29/08 (2006.01); H01L 29/165 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7816 (2013.01); H01L 21/823418 (2013.01); H01L 29/086 (2013.01); H01L 29/0843 (2013.01); H01L 29/0869 (2013.01); H01L 29/0878 (2013.01); H01L 29/0886 (2013.01); H01L 29/1608 (2013.01); H01L 29/6606 (2013.01); H01L 29/66053 (2013.01); H01L 29/6659 (2013.01); H01L 29/66068 (2013.01); H01L 29/66628 (2013.01); H01L 29/66636 (2013.01); H01L 29/66689 (2013.01); H01L 29/7834 (2013.01); H01L 29/7842 (2013.01); H01L 29/7848 (2013.01); H01L 29/165 (2013.01); H01L 29/66545 (2013.01);
Abstract

Integrated circuit devices with field effect transistors have source and drain regions that include a first and a second layer. The first layer is formed below the plane of the channel region. The first layer includes doped silicon and carbon that has a crystal lattice structure that is smaller than that of silicon. The second layer is formed over the first layer and rises above the plane of the channel region. The second layer is formed by a material that includes doped epitaxially grown silicon. The second layer has an atomic fraction of carbon less than half that of the first layer. The first layer is formed to a depth at least 10 nm below the surface of the channel region. This structure facilitates the formation of source and drain extension areas that form very shallow junctions. The devices provide sources and drains that have low resistance while being comparatively resistant to short channel effects.


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