The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9349787 B1

PDF
Full Text
Expired
Date of Patent:
May. 24, 2016

Filed:

Apr. 29, 2015
Applicant:

Globalfoundries, Inc., Grand Cayman, KY;

Inventors:

Ki Young Lee, Schenectady, NY (US);

Sanggil Bae, Clifton Park, NY (US);

Tony Joung, Watervliet, NY (US);

Assignee:

GLOBALFOUNDRIES, INC., Grand Cayman, KY;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 23/522 (2006.01); H01L 49/02 (2006.01);
U.S. Cl.
CPC ...
H01L 28/60 (2013.01); H01L 21/76877 (2013.01); H01L 23/5226 (2013.01);
Abstract

Integrated circuits and methods for producing the same are provided. A method for producing an integrated circuit includes forming a capacitor trench through a dielectric layer, and forming a base layer overlying the dielectric layer and within the capacitor trench. A base layer via gap is formed in the base layer, where the base layer via gap is positioned overlying the dielectric layer and the first contact. A base plate and a shield are formed from the base layer, where the base plate is within the capacitor trench. A capacitor insulating layer is formed overlying the base plate, the base layer, and within the base layer via gap, and a via is formed through the base layer via gap. A second contact and a top plate are simultaneously formed, where the second contact is formed in the via and the top plate is formed in the capacitor trench.


Find Patent Forward Citations

Loading…