The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 24, 2016
Filed:
Feb. 10, 2015
Omnivision Technologies, Inc., Santa Clara, CA (US);
Wei-Feng Lin, HsinChu, TW;
Chi-Chih Huang, HsinChu, TW;
OmniVision Technologies, Inc., Santa Clara, CA (US);
Abstract
A method for manufacturing one or more curved image sensor systems includes (a) at elevated pressure relative to atmospheric pressure, bonding a light-transmitting substrate to an image sensor wafer having at least one pixel array, to form a composite wafer with a respective hermetically sealed cavity between the light-transmitting substrate and each pixel array, and (b) thinning the image sensor wafer of the composite wafer to induce deformation of the image sensor wafer to form a concavely curved pixel array from each pixel array. A curved image sensor system includes (a) an image sensor substrate having a concave light-receiving surface and a pixel array located along the concave light-receiving surface, (b) a light-transmitting substrate bonded to the image sensor substrate by a bonding layer, and (c) a hermetically sealed cavity, bounded at least by the concave light-receiving surface, the light-transmitting substrate, and the bonding layer.