The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 24, 2016

Filed:

Jul. 16, 2014
Applicant:

Power Integrations, Inc., San Jose, CA (US);

Inventors:

David Kung, Foster City, CA (US);

David Michael Hugh Matthews, Los Gatos, CA (US);

Balu Balakrishnan, Saratoga, CA (US);

Assignee:

Power Integrations, Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 27/08 (2006.01); H04B 5/00 (2006.01); H01L 27/02 (2006.01); H04B 15/00 (2006.01); H05K 7/14 (2006.01); H01L 23/552 (2006.01); H01L 49/02 (2006.01); H01L 23/48 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0248 (2013.01); H01L 23/48 (2013.01); H01L 23/49541 (2013.01); H01L 23/49575 (2013.01); H01L 23/552 (2013.01); H01L 28/10 (2013.01); H04B 15/005 (2013.01); H05K 7/14 (2013.01); H01L 24/48 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48257 (2013.01);
Abstract

An integrated circuit package includes an encapsulation and a lead frame with a portion of the lead frame disposed within the encapsulation. The lead frame includes a first conductor having a first conductive loop and a third conductive loop disposed within the encapsulation. The third conductive loop is wound in a direction relative to the first conductive loop such that the first conductive loop is coupled out of phase with the third conductive loop. The lead frame also includes a second conductor galvanically isolated from the first conductor. The second conductor includes a second conductive loop disposed within the encapsulation proximate to the first conductive loop to provide a communication link between the first and second conductors.


Find Patent Forward Citations

Loading…