The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 24, 2016
Filed:
Jan. 05, 2014
Applicant:
Infineon Technologies Austria Ag, Villach, AT;
Inventors:
Assignee:
Infineon Technologies Austria AG, Villach, AT;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/538 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49586 (2013.01); H01L 23/315 (2013.01); H01L 23/3121 (2013.01); H01L 23/4951 (2013.01); H01L 23/49513 (2013.01); H01L 24/24 (2013.01); H01L 24/29 (2013.01); H01L 24/82 (2013.01); H01L 24/97 (2013.01); H01L 21/561 (2013.01); H01L 23/5389 (2013.01); H01L 2224/24137 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/2957 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/92244 (2013.01); H01L 2224/97 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/1426 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1434 (2013.01);
Abstract
A chip arrangement is provided which comprises a carrier; and at least two chips arranged over the carrier; wherein a continuous insulating layer is arranged between the at least two chips and between the carrier and at least one of the at least two chips.