The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 24, 2016

Filed:

Mar. 28, 2014
Applicant:

Globalfoundries Singapore Pte. Ltd., Singapore, SG;

Inventors:

Liang Li, Singapore, SG;

Xuesong Rao, Singapore, SG;

Martina Damayanti, Singapore, SG;

Wei Lu, Singapore, SG;

Alex See, Singapore, SG;

Yoke Leng Lim, Singapore, SG;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/8234 (2006.01); H01L 21/311 (2006.01); H01L 21/28 (2006.01); H01L 29/06 (2006.01); H01L 21/762 (2006.01); H01L 27/115 (2006.01);
U.S. Cl.
CPC ...
H01L 21/823481 (2013.01); H01L 21/28229 (2013.01); H01L 21/28273 (2013.01); H01L 21/31111 (2013.01); H01L 21/31144 (2013.01); H01L 21/762 (2013.01); H01L 27/11526 (2013.01); H01L 27/11546 (2013.01); H01L 29/0649 (2013.01);
Abstract

Device and a method of forming a device are presented. The method includes providing a substrate prepared with isolation regions. The substrate includes first, second and third regions. The first region includes a memory region, the second region includes a high voltage (HV) region and the third region includes a logic region. An additional dielectric layer covering the substrate and the isolation regions is formed. A first select region is selectively processed while protecting first non-select regions. The first select region is one of the first, second and third device regions. A first gate dielectric is formed on the select region. Top substrate active area and isolation regions of the first non-select regions are not exposed during processing of the first select region and forming the first gate dielectric.


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