The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 24, 2016

Filed:

Dec. 13, 2013
Applicant:

Globalfoundries Inc., Grand Cayman, KY;

Inventors:

Zhiguo Sun, Halfmoon, NY (US);

Daniel Smith, Ballston Spa, NY (US);

Kumarapuram Gopalakrishnan, Malta, NY (US);

Hung-Wei Liu, Saratoga Springs, NY (US);

Assignee:

GLOBALFOUNDRIES INC., Grand Cayman, KY;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 21/3205 (2006.01); H01L 21/768 (2006.01); H01L 23/31 (2006.01); H01L 23/29 (2006.01); H01L 21/308 (2006.01); H01L 21/311 (2006.01); H01L 21/321 (2006.01);
U.S. Cl.
CPC ...
H01L 21/32051 (2013.01); H01L 21/3081 (2013.01); H01L 21/31138 (2013.01); H01L 21/31144 (2013.01); H01L 21/3212 (2013.01); H01L 21/76846 (2013.01); H01L 21/76898 (2013.01); H01L 23/291 (2013.01); H01L 23/3192 (2013.01); H01L 23/481 (2013.01); H01L 2924/0002 (2013.01);
Abstract

Devices and methods for forming semiconductor devices with a protection layer for a dielectric mask layer are provided. One method includes, for instance; obtaining a substrate having at least one of a dielectric layer and a metal layer; forming a first SiCN dielectric mask layer on a top surface of at least one of the dielectric layer and a metal layer; and forming a silicon nitride (SiNx) cap layer on a top surface of the first SiCN dielectric mask layer. One intermediate semiconductor device includes, for instance: a substrate having at least one of a dielectric layer and a metal layer; a first SiCN dielectric mask layer on a top surface of at least one of the dielectric layer and a metal layer; and a silicon nitride (SiNx) cap layer on a top surface of the first SiCN dielectric mask layer.


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