The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 24, 2016

Filed:

Aug. 27, 2014
Applicants:

Cheong Min Hong, Austin, TX (US);

Tahmina Akhter, Austin, TX (US);

Gilles J. Muller, Austin, TX (US);

Inventors:

Cheong Min Hong, Austin, TX (US);

Tahmina Akhter, Austin, TX (US);

Gilles J. Muller, Austin, TX (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 11/34 (2006.01); G11C 16/04 (2006.01); H01L 27/115 (2006.01); H01L 21/8234 (2006.01); H01L 29/66 (2006.01); H01L 21/265 (2006.01); H01L 29/788 (2006.01); H01L 29/78 (2006.01); H01L 29/423 (2006.01); H01L 21/3213 (2006.01); G11C 16/24 (2006.01); G11C 16/08 (2006.01);
U.S. Cl.
CPC ...
G11C 16/0433 (2013.01); G11C 16/08 (2013.01); G11C 16/24 (2013.01); H01L 21/26513 (2013.01); H01L 21/32133 (2013.01); H01L 21/823437 (2013.01); H01L 21/823481 (2013.01); H01L 21/823493 (2013.01); H01L 27/11524 (2013.01); H01L 27/11526 (2013.01); H01L 29/42324 (2013.01); H01L 29/66575 (2013.01); H01L 29/66825 (2013.01); H01L 29/788 (2013.01); H01L 29/7833 (2013.01);
Abstract

The present disclosure provides for semiconductor structures and methods for making semiconductor structures. In one embodiment, isolation regions are formed in a substrate, and wells are formed between the isolation regions. The wells include a first low voltage well and a second low voltage well in a logic region of the substrate, and a memory array well in an NVM region of the substrate. A first layer of oxide is formed over the first low voltage well and the memory array well, and a second layer of oxide is formed over the second low voltage well, the second layer being thinner than the first layer. Gates are formed over the wells, including a first gate over the first low voltage well, a second gate over the second low voltage well, and a memory cell gate over the memory array well. Source/drain extension regions are formed around the gates.


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