The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 24, 2016
Filed:
Feb. 20, 2012
Isao Iwayama, Osaka, JP;
Taichiro Nishikawa, Osaka, JP;
Toshiya Ikeda, Toyama, JP;
Shigeki Koyama, Toyama, JP;
Isao Iwayama, Osaka, JP;
Taichiro Nishikawa, Osaka, JP;
Toshiya Ikeda, Toyama, JP;
Shigeki Koyama, Toyama, JP;
SUMITOMO ELECTRIC INDUSTREIS, LTD., Osaka-shi, Osaka, JP;
A.L.M.T. Corp., Tokyo, JP;
Abstract
A composite member has a substrate made of a composite material having SiC combined with magnesium or a magnesium alloy, and has a warpage degree of not less than 0.01×10and not more than 10×10, the warpage degree being defined as lmax/Dmax, where lmax being a difference between a maximum value and a minimum value of surface displacement of one surface of composite member measured along a longest side thereof, and Dmax being a length of the longest side. Thereby, a composite member capable of efficiently dissipating heat to an installation object, a heat-dissipating member using the composite member, and a semiconductor device having the heat-dissipating member are provided.