The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 24, 2016
Filed:
Feb. 04, 2014
Applicant:
Freescale Semiconductor, Inc., Austin, TX (US);
Inventors:
Alan J. Magnus, Gilbert, AZ (US);
Chad S. Dawson, Queen Creek, AZ (US);
Stephen R. Hooper, Mesa, AZ (US);
Assignee:
Freescale Semiconductor, Inc., Austin, TX (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B81B 7/00 (2006.01); B81C 1/00 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
B81C 1/00896 (2013.01); B81B 7/0058 (2013.01); B81C 1/00865 (2013.01); H01L 21/6836 (2013.01); B81B 2201/0264 (2013.01); B81B 2203/0127 (2013.01);
Abstract
A MEMS wafer () includes a front side () having a plurality of MEMS structure sites () at which MEMS structures () are located. A method () for protecting the MEMS structures () includes applying () a non-active feature () on the front side of the MEMS wafer in a region that is devoid of the MEMS structures and mounting () the front side of the MEMS wafer in a dicing frame () such that a back side () of the MEMS wafer is exposed. The MEMS wafer is then diced () from the back side into a plurality of MEMS dies ().