The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 17, 2016

Filed:

Nov. 04, 2013
Applicant:

Lattice Semiconductor Corporation, Hillsboro, OR (US);

Inventor:

Ban Pak Wong, Milpitas, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/10 (2006.01); H05K 7/12 (2006.01); H05K 1/11 (2006.01); H01L 23/50 (2006.01); H01L 23/498 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 1/112 (2013.01); H01L 23/49838 (2013.01); H01L 23/50 (2013.01); H01L 23/49816 (2013.01); H05K 3/3436 (2013.01); H05K 2201/09227 (2013.01); H05K 2201/10734 (2013.01);
Abstract

In one embodiment, a ball grid array (BGA) of a packaged semiconductor device and a corresponding landing pad array of a printed circuit board each have a layout defined by an interconnection array having (i) an inner sub-array of locations having connectors arranged in rows and columns separated by a specified pitch and (ii) an outer rectangular ring of locations having connectors arranged in rows and columns separated by the specified pitch. The outer rectangular ring is separated from the inner sub-array by a depopulated rectangular ring having a width of at least twice the specified pitch, wherein the depopulated rectangular ring has no connectors. The outer rectangular ring has empty locations having no connectors. Some of those empty locations define depopulated sets that divide the outer rectangular ring into a number of different contiguous sets of locations having connectors that enable pin escape for connectors of the device's BGA.


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