The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 17, 2016

Filed:

Apr. 10, 2014
Applicant:

Semiconductor Components Industries, Llc, Phoenix, AZ (US);

Inventors:

Jaume Roig Guitart, Oudenaarde, BE;

Zia Hossain, Tempe, AZ (US);

Peter Moens, Zottegrm, BE;

Gordon M. Grivna, Mesa, AZ (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/76 (2006.01); H01L 29/06 (2006.01); H01L 29/40 (2006.01); H01L 29/423 (2006.01); H01L 21/762 (2006.01);
U.S. Cl.
CPC ...
H01L 29/0649 (2013.01); H01L 21/76229 (2013.01); H01L 29/0634 (2013.01); H01L 29/402 (2013.01); H01L 29/4236 (2013.01);
Abstract

An electronic device can include an electronic component and a termination region adjacent to the electronic component region. In an embodiment, the termination region can include an insulating region that extends a depth into a semiconductor layer, wherein the depth is less than 50% of the thickness of the semiconductor layer. In another embodiment, the termination region can include a first insulating region that extends a first depth into the semiconductor layer, and a second insulating region that extends a second depth into the semiconductor layer, wherein the second depth is less than the first depth. In another aspect, a process of forming an electronic device can include patterning a semiconductor layer to define a trench within termination region while another trench is being formed for an electronic component within an electronic component region.


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