The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 17, 2016

Filed:

Aug. 22, 2013
Applicant:

Mpi Corporation, Hsinchu County, TW;

Inventors:

Chung-Tse Lee, Hsinchu County, TW;

Chien-Chou Wu, Hsinchu County, TW;

Tsung-Yi Chen, Hsinchu County, TW;

Ming-Chi Chen, Hsinchu County, TW;

Assignee:

MPI Corporation, Hsinchu County, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 31/00 (2006.01); G01R 1/04 (2006.01); G01R 3/00 (2006.01); G01R 1/073 (2006.01);
U.S. Cl.
CPC ...
G01R 1/0491 (2013.01); G01R 1/07378 (2013.01); G01R 3/00 (2013.01); Y10T 29/49126 (2015.01);
Abstract

The probe card includes a substrate, at least two IC boards, and a plurality of probe pads. The IC boards are located on the substrate, and a predetermined distance is formed between the IC boards. Each of the IC boards has a plurality of lead connection points. The probe pads are plated on the IC boards, and are respectively connected to the lead connection points to cover the lead connection points. A probe area is surrounded by the probe pads on each of the IC boards. The probe pads are used to abut against plural probes.


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