The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 10, 2016
Filed:
Oct. 30, 2013
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Saverio Trotta, Munich, DE;
Jagjit Singh Bal, Ottobrunn, DE;
Maciej Wojnowski, Munich, DE;
Ernst Seler, Munich, DE;
Mehran Pour Mousavi, Munich, DE;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01P 5/107 (2006.01); H01P 3/12 (2006.01); H04B 10/2575 (2013.01); H04B 10/572 (2013.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H01P 5/107 (2013.01); H01P 3/12 (2013.01); H04B 10/2575 (2013.01); H04B 10/572 (2013.01); H05K 1/024 (2013.01); H05K 1/0206 (2013.01); H05K 1/0242 (2013.01); H05K 1/0251 (2013.01); H05K 1/116 (2013.01); H05K 1/181 (2013.01); H05K 3/4697 (2013.01);
Abstract
According to an embodiment, a circuit board includes a signal line including at least portion of a first conductive layer that has a first portion extending over a cavity in the circuit board from a first side of the cavity. The circuit board also includes a first plurality of conductive vias surrounding the cavity and the first plurality of vias include at least one blind via disposed adjacent to the first side of the cavity.