The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 10, 2016

Filed:

Sep. 08, 2011
Applicants:

Yongzhong HU, Cupertino, CA (US);

Sung-shan Tai, San Jose, CA (US);

Inventors:

Yongzhong Hu, Cupertino, CA (US);

Sung-Shan Tai, San Jose, CA (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/8234 (2006.01); H01L 29/78 (2006.01); H01L 29/66 (2006.01); H01L 21/285 (2006.01); H01L 29/417 (2006.01); H01L 29/45 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7813 (2013.01); H01L 21/28518 (2013.01); H01L 21/823418 (2013.01); H01L 29/665 (2013.01); H01L 29/66507 (2013.01); H01L 29/66727 (2013.01); H01L 29/66734 (2013.01); H01L 29/7806 (2013.01); H01L 29/7839 (2013.01); H01L 29/7845 (2013.01); H01L 29/41766 (2013.01); H01L 29/456 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A trenched semiconductor power device includes a trenched gate insulated by a gate insulation layer and surrounded by a source region encompassed in a body region above a drain region disposed on a bottom surface of a semiconductor substrate. The source region surrounding the trenched gate includes a metal of low barrier height to function as a Schottky source and that may include a PtSi, ErSi layer and may further be a metal silicide layer having the low barrier height. A top oxide layer is disposed under a silicon nitride spacer on top of the trenched gate for insulating the trenched gate from the source region. A source contact disposed in a trench opened into the body region for contacting a body-contact dopant region and covering with a conductive metal layer such as a Ti/TiN layer.


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