The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 10, 2016

Filed:

May. 16, 2011
Applicants:

Qingchun Zhang, Cary, NC (US);

Craig Capell, Hillsborough, NC (US);

Anant Agarwal, Chapel Hill, NC (US);

Sei-hyung Ryu, Cary, NC (US);

Inventors:

Qingchun Zhang, Cary, NC (US);

Craig Capell, Hillsborough, NC (US);

Anant Agarwal, Chapel Hill, NC (US);

Sei-Hyung Ryu, Cary, NC (US);

Assignee:

Cree, Inc., Durham, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); H01L 29/10 (2006.01); H01L 29/36 (2006.01); H01L 29/732 (2006.01); H01L 29/739 (2006.01); H01L 29/74 (2006.01); H01L 29/78 (2006.01); H01L 29/861 (2006.01); H01L 29/16 (2006.01);
U.S. Cl.
CPC ...
H01L 29/1016 (2013.01); H01L 29/0661 (2013.01); H01L 29/1004 (2013.01); H01L 29/1095 (2013.01); H01L 29/36 (2013.01); H01L 29/732 (2013.01); H01L 29/7397 (2013.01); H01L 29/74 (2013.01); H01L 29/7813 (2013.01); H01L 29/861 (2013.01); H01L 29/0615 (2013.01); H01L 29/1608 (2013.01);
Abstract

A negative bevel edge termination for a Silicon Carbide (SiC) semiconductor device is disclosed. In one embodiment, the negative bevel edge termination includes multiple steps that approximate a smooth negative bevel edge termination at a desired slope. More specifically, in one embodiment, the negative bevel edge termination includes at least five steps, at least ten steps, or at least 15 steps. The desired slope is, in one embodiment, less than or equal to fifteen degrees. In one embodiment, the negative bevel edge termination results in a blocking voltage for the semiconductor device of at least 10 kilovolts (kV) or at least 12 kV. The semiconductor device is preferably, but not necessarily, a thyristor such as a power thyristor, a Bipolar Junction Transistor (BJT), an Insulated Gate Bipolar Transistor (IGBT), a U-channel Metal-Oxide-Semiconductor Field Effect Transistor (UMOSFET), or a PIN diode.


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