The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 10, 2016

Filed:

Jun. 24, 2014
Applicant:

Taiwan Semiconductor Manufacturing Company Limited, Hsinchu, TW;

Inventors:

Jiun-Peng Wu, Hsinchu, TW;

Tetsu Ohtou, Hsinchu, TW;

Ching-Wei Tsai, Hsinchu, TW;

Chih-Hao Wang, Hsinchu County, TW;

Chi-Wen Liu, Hsinchu, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/336 (2006.01); H01L 27/11 (2006.01); H01L 29/775 (2006.01); H01L 29/06 (2006.01); H01L 21/8234 (2006.01);
U.S. Cl.
CPC ...
H01L 29/0665 (2013.01); H01L 21/8234 (2013.01); H01L 29/06 (2013.01);
Abstract

A semiconductor device includes a substrate, a first source/drain (S/D), a second S/D, and a semiconductor sheet unit. The substrate extends in a substantially horizontal direction. The first S/D is formed on the substrate. The second S/D is disposed above the first S/D. The semiconductor sheet unit extends in a substantially vertical direction and interconnects the first S/D and the second S/D. A method for fabricating the semiconductor device is also disclosed.


Find Patent Forward Citations

Wu, Jiun-Peng. (2016). Semiconductor device including a semiconductor sheet unit interconnecting a source and a drain (U.S. Patent No. 9337263). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9337263

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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