The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 10, 2016
Filed:
Oct. 28, 2014
Applicant:
Freescale Semiconductor, Inc., Austin, TX (US);
Inventor:
Rama I. Hegde, Austin, TX (US);
Assignee:
Freescale Semiconductors, Inc., Austin, TX (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/00 (2006.01); H01L 23/495 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 24/45 (2013.01); H01L 21/4821 (2013.01); H01L 21/4846 (2013.01); H01L 23/49548 (2013.01); H01L 23/49582 (2013.01); H01L 23/49586 (2013.01); H01L 24/43 (2013.01); H01L 2224/43 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/45573 (2013.01); H01L 2224/45647 (2013.01); H01L 2224/45666 (2013.01); H01L 2224/45681 (2013.01); H01L 2224/45687 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48257 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/12042 (2013.01);
Abstract
A coating layer for use in copper integrated circuit interconnect and other conductive structures hinders and decreases oxide growth on surfaces of such conductive structures. The coating layer includes an amorphous copper containing layer deposited on a crystalline copper substrate, such as utilized for a lead frame and a bonding wire. Additional amorphous layers may be interposed between the amorphous copper containing layer and the copper substrate, such as an amorphous tantalum nitride layer and an amorphous titanium nitride layer.