The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 10, 2016
Filed:
Mar. 13, 2014
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 25/07 (2006.01); H01L 23/00 (2006.01); H01L 23/29 (2006.01); H01L 25/00 (2006.01); H01L 29/16 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 23/564 (2013.01); H01L 23/293 (2013.01); H01L 24/48 (2013.01); H01L 25/50 (2013.01); H01L 29/1608 (2013.01); H01L 21/561 (2013.01); H01L 21/568 (2013.01); H01L 23/3107 (2013.01); H01L 23/3135 (2013.01); H01L 25/072 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48472 (2013.01); H01L 2224/48491 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/1301 (2013.01); H01L 2924/1306 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13062 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/181 (2013.01);
Abstract
A semiconductor component includes a semiconductor body having a top side and a bottom side opposite the top side. A top metallization is applied to the top side and a bottom metallization is applied to the bottom side. A moisture barrier completely seals the semiconductor body in cooperation with the top metallization and the bottom metallization.