The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9337088 B1

PDF
Full Text
Expired
Date of Patent:
May. 10, 2016

Filed:

Jun. 12, 2014
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

William F. Clark, Jr., Essex Junction, VT (US);

Robert R. Robison, Colchester, VT (US);

Hung H. Tran, Hopewell Junction, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 49/02 (2006.01); H01L 23/367 (2006.01); H01L 23/522 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76877 (2013.01); H01L 23/3677 (2013.01); H01L 23/5225 (2013.01); H01L 23/5228 (2013.01); H01L 28/20 (2013.01);
Abstract

An semiconductor structure, method of fabrication therefor, and design structure therefor is provided. A thermal grid is formed over at least a portion of a substrate. An insulating layer is formed over at least a portion of the thermal grid. A resistor is formed over at least a portion of the insulating layer. A buried interconnect is connected to the thermal grid via at least one contact. The buried interconnect is adapted to receive thermal energy from the thermal grid via the at least one contact.


Find Patent Forward Citations

Clark, Jr., William. (2016). Mol resistor with metal grid heat shield (U.S. Patent No. 9337088). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9337088

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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