The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 10, 2016
Filed:
Apr. 05, 2013
Applicant:
Shinko Electric Industries Co., Ltd., Nagano, JP;
Inventor:
Tomoharu Fujii, Nagano, JP;
Assignee:
SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01F 5/00 (2006.01); H01F 27/30 (2006.01); H01L 27/08 (2006.01); H01F 17/00 (2006.01); H01F 41/04 (2006.01);
U.S. Cl.
CPC ...
H01F 17/0006 (2013.01); H01F 41/041 (2013.01); H01F 41/046 (2013.01); H01F 2017/0066 (2013.01);
Abstract
A wiring substrate includes a first insulating layer, a first magnetic layer that is a first plating film formed on the first insulating layer, a flat coil formed on the first magnetic layer, and a second magnetic layer that is a second plating film formed on the flat coil.