The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 10, 2016
Filed:
Dec. 26, 2014
Shinko Electric Industries Co., Ltd., Nagano, JP;
Satoshi Miyazawa, Nagano, JP;
Takahiro Rokugawa, Nagano, JP;
SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano, JP;
Abstract
A wiring substrate includes a first metal layer formed on a wiring layer; a solder resist layer that covers the wiring layer and the first metal layer, and is provided with an open portion that exposes a part of an upper surface of the first metal layer; a second metal layer formed on the upper surface of the first metal layer that is exposed within the open portion; and a third metal layer formed on the second metal layer, wherein the solder resist layer covers an outer peripheral portion of the upper surface of the first metal layer to expose the part of the upper surface of the first metal layer within the open portion, and wherein an upper surface of the second metal layer is flush with an upper surface of the solder resist layer or projects from the upper surface of the solder resist layer.