The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 10, 2016
Filed:
Jun. 27, 2011
Masaya Ehira, Hyogo, JP;
Akira Nambu, Hyogo, JP;
Shigeo Kashiwai, Hyogo, JP;
Masafumi Fukuzumi, Hyogo, JP;
Masaya Ehira, Hyogo, JP;
Akira Nambu, Hyogo, JP;
Shigeo Kashiwai, Hyogo, JP;
Masafumi Fukuzumi, Hyogo, JP;
KOBELCO RESEARCH INSTITUTE, INC., Kobe-shi, JP;
HYOGO PREFECTURE, Kobe-shi, JP;
Abstract
The present invention provides a Cu—In—Ga—Se powder containing Cu, In, Ga and Se in which cracks do not occur during sintering or processing, and a sintered body and sputtering target, each using the same. The present invention relates to a powder containing Cu, In Ga and Se, which contains a Cu—In—Ga—Se compound and/or a Cu—In—Se compound in an amount of 60 mass % or more in total. The powder of the present invention preferably contains an In—Se compound in an amount of 20 mass % or less and/or a Cu—In compound in an amount of 20 mass % or less.