The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 10, 2016

Filed:

Nov. 05, 2012
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventors:

Masataka Kato, Hiratsuka, JP;

Junichiro Iri, Yokohama, JP;

Keisuke Kishimoto, Yokohama, JP;

Taichi Yonemoto, Isehara, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/16 (2006.01); H01L 21/768 (2006.01); H01J 3/02 (2006.01);
U.S. Cl.
CPC ...
B41J 2/1603 (2013.01); B41J 2/1623 (2013.01); B41J 2/1628 (2013.01); B41J 2/1629 (2013.01); B41J 2/1631 (2013.01); B41J 2/1634 (2013.01); B41J 2/1635 (2013.01); H01J 3/022 (2013.01); H01J 2329/00 (2013.01); H01L 21/76802 (2013.01); H01L 21/76825 (2013.01); Y10T 29/42 (2015.01); Y10T 29/49083 (2015.01); Y10T 29/49401 (2015.01);
Abstract

A method for manufacturing a liquid ejection head substrate, including: (1) a step for etching a substrate, which has an energy generating element at a side of a first surface, from a side of a second surface, which is a surface on the opposite side from the first surface, thereby to form at a time at least a part of a liquid supply port and a recess along a cutting section of the substrate; (2) a step for irradiating a laser beam toward the side of first surface from the etched surface of the recess so as to form a reformed portion inside the substrate; and (3) a step for cutting the substrate at the reformed portion.


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